Chip Quik Inc. Việt Nam | Chip Quik Inc. SMDSWLF.059 3.3 1LB

SMDSWLF.059 3.3 1LB

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Mã digikey

315-SMDSWLF.0593.31LB-ND

Manufacturer

Chip Quik Inc.

Product description

SOLDER WIRE SN96.5/AG3.0/CU0.5

Manufacturer Product Number

SMDSWLF.059 3.3 1LB

Manufacturer Standard Lead Time

4 Weeks

Detailed description

Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (453.59g)

Datasheet

http://www.chipquik.com/datasheets/SMDSWLF.059 3.3 1LB.pdf Datasheet

Product Attributes

Select all 		Type Description
Manufacturer Chip Quik Inc.
Series -
Package Bulk
Part Status Active
Type Wire Solder
Composition Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter 0.059" (1.50mm)
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No-Clean, Water Soluble
Wire Gauge -
Process Lead Free
Form Spool, 1 lb (453.59g)
Shelf Life -
Shelf Life Start -
Storage/Refrigeration Temperature -
Similar

Documents and Media

RESOURCE TYPE Link
Datasheet http://www.chipquik.com/datasheets/SMDSWLF.059 3.3 1LB.pdf Datasheet
Image -
Video -

Environmental and Export Classifications

ATTRIBUTE DESCRIPTION
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8311.30.6000

Stock

Factory stock:

-

Can ship immediately

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Bulk

QUANTITY UNIT PRICE EXT PRICE
Box Icon 1 4,823,551 4,823,551
Package Icon Manufacturers Standard Package

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